During the third day of the workshop, participants met in subgroups to discuss some of the challenges in additive manufacturing (AM). These groups aligned with the four sessions of the workshop:
Breakout groups were asked to discuss two or three principal topics and consider the following overarching questions:
Workshop participants were also asked to provide individual responses to similar questions about top priority research needs for advancing AM, top “nontechnical” challenges to commercialization of AM, and actions
that could help address these nontechnical challenges. Descriptions of the subgroup discussions and individual responses are provided in the following subsections.
Subgroup Members
Jarred Heigel (National Institute of Standards and Technology), Carolin Körner (Friedrich-Alexander Universität Erlangen-Nürnberg), Amit Surana (United Technologies Research Center), R. Allen Roach (Sandia National Laboratories), Kilian Wasmer (Empa), Shoufeng Yang (KU Leuven), and Celia Merzbacher (SRI International)
This breakout group discussion was led by Heigel, and conversations focused on sensor technology, algorithm development and use, knowledge transfer, challenges, and priorities moving forward. The following three questions were proposed to start the discussion:
Several subgroup members highlighted the following technical challenges:
Subgroup members discussed the challenge of machine interoperability and how to encourage machine manufacturers to be more transparent with their systems and processes. Currently, the high cost of developing these systems and the associated intellectual property deters manufacturers from making their systems more transparent. However, many manufacturers are small organizations that may lack the resources and expertise required to develop real-time monitoring and process control strategies required by the end user. On the other end of the spectrum, organizations with monitoring and control expertise often are not as familiar with the intricacies of the process and lack the ability to communicate directly with the machines. Some members of the subgroup speculated that case studies and cost analysis could help to convince manufacturers that increasing the transparency of their machines and enhancing collaboration will serve the greater good of the AM community and ultimately increase manufacturers’ customer base. The semiconductor industry—which has benefited from collaborations and partnerships—could be an exemplar of how to encourage transparency and collaboration among small companies. Finally, many subgroup members suggested that a follow-on workshop could focus on data collection and improved decision making.
Subgroup Members
Annett Seide (MTU Aero Engines), Lyle Levine (National Institute of Standards and Technology), John Turner (Oak Ridge National Laboratory), Ade Makinde (General Electric Global Research Center), Kyle Johnson (Sandia National Laboratories), Eric Jägle (Max Planck Institute), Deniece Korzekwa (Los Alamos National Laboratory), and Christian Leinenbach (Empa)
This breakout group discussion was led by Seide, who noted that many of the challenges in representing microstructure evolution, alloy design, and part suitability are encompassed by the larger material science research effort. However, there are unique areas of ongoing research that are specific to AM materials and conditions. The subgroup first discussed the lack of thermophysical data under AM conditions, and several members suggested the following short-, intermediate-, and long-term goals:
These members emphasized that the most important areas of research for the lack of thermophysical data are first principles and machine learning approaches.
The subgroup next discussed microstructure evolution and the challenge of developing and validating models. In particular, several members described high-fidelity models, coupled multiphysics models (e.g., to get location-specific microstructure evolution and to look through the solidification and intrinsic heat treatment processes as well as post-build processing), and reduced-order models as particularly challenging. Many subgroup members noted several promising short-, intermediate-, and long-term research areas:
temporal and spatial scale bridging, and three-dimensional microstructure characterization information.
The third topic discussed was coupled multiphysics and multiscale capabilities for AM, including the laser-material interaction, the time-dependent thermal profile (including fluid flow), microstructure evolution, micromechanics, and macroscale thermomechanics. Many subgroup members noted several promising short-, intermediate-, and long-term research areas:
Several subgroup members also discussed the following nontechnical challenges across AM:
To increase collaboration and better address technical and nontechnical challenges, several subgroup members suggested that industry and academia support efforts that provide foundations for collaboration (e.g., AM-Bench). Industry might consider funding defined challenges in which academia and laboratory teams could compete. Programs could be created for targeted collaborative industry–academia–laboratory research to tackle specific application challenges. These subgroup members emphasized the importance of having adequate, stable funding available over extended time periods and suggested that the U.S. Department of Energy Hubs1 concept could be applicable for AM. Many subgroup members suggested specific actions that could help address these challenges, including a call for proposals in the industry–academia–laboratory research areas and the expansion of educational programs that are domain specific and multidisciplinary. Some members of this breakout group suggested that a follow-on workshop could address topics such as challenges and opportunities in topology and shape optimization with site-specific microstructure control as well as multidisciplinary educational programs for AM processes.
Subgroup Members
Mustafa Megahed (ESI Group), Wing Kam Liu (Northwestern University), Jian Cao (Northwestern University), Tahany El-Wardany (United Technologies Research Center), and Winfried Keiper (European Technology Platform for Advanced Engineering Materials and Technologies)
Megahed led this breakout group, which discussed modeling aspects of process and machine design. Megahed, Liu, Cao, El-Wardany, and
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1 For more information on the U.S. Department of Energy’s Hubs, see https://www.energy.gov/science-innovation/innovation/hubs, accessed March 11, 2019.
Keiper proposed the following challenges and research needs for this topic:
These subgroup members also highlighted three major nontechnical challenges:
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2 Alloying elements are defined as metallic or nonmetallic elements that are added in specified or standard amounts to a base metal to make an alloy (Business Dictionary, 2019), and doping is the mixing of a small amount of an impurity into a silicon crystal (Brain, 2001).
The subgroup members also discussed partnerships. Several members noted successful models such as America Makes,3 Horizon 2020,4 CleanSky,5 and other data sharing efforts that encourage community databases. Other options could be for industries to enable more internships and fellowships for students and researchers. A number of subgroup members also suggested more partnerships among researchers in the European Union and the United States and among small- and medium-size enterprises; this could encourage more collaboration, data exchange, and international research funding.
For a possible follow-on workshop, some of the subgroup members proposed themes including the definition of joint standards and tolerances, digital twin and threads for AM, interdisciplinary education, and the various intermediate-term challenges and goals that were discussed throughout the workshop.
Subgroup Members
David Teter (Los Alamos National Laboratory), Jens Telgkamp (Airbus Operations GmbH), Vincent Paquit (Oak Ridge National Laboratory), Paolo Gennaro (GF Precicast Additive SA), Johannes Henrich Schleifenbaum (Fraunhofer Institute for Laser Technology), Richard Ricker (National Institute of Standards and Technology), Josh Sugar (Sandia National Laboratories), and Ben Dutton (Manufacturing Technology Centre)
Teter and Telgkamp led the discussion for this subgroup, which focused on accelerating product and process qualification and certification. This discussion was divided into short-term (less than 5 years) and intermediate-term (5 to 10 years) goals that could enable a long-term vision for AM.
Teter explained that the long-term vision is the ability to design, print, and qualify a product correctly the first time. This includes as-built quality, in which people have very limited destructive evaluation for parts
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3 For more information on America Makes, see https://www.americamakes.us, accessed March 11, 2019.
4 For more information on Horizon 2020, see https://ec.europa.eu/programmes/horizon2020/, accessed March 11, 2019.
5 For more information on CleanSky, see https://www.cleansky.eu, accessed March 11, 2019.
being generated, and built-in quality assurance, in which data are collected as a part is being printed. Modeling and simulation play an important role—a multiphysics process–structure–property–performance prediction is needed. Cybersecurity is another concern, particularly in terms of building resiliency to the threat of fraudulent components over the next 10 years. Several subgroup members noted that the ability to track each part is needed, including attaching the license to build and proof of quality to each part. Lastly, some subgroup members commented on the need for government-to-government agreements on AM with shared objectives, data, and frameworks. They suggested that long-term efforts should focus on the need for AM to be operational and fully accepted by certification groups.
To advance this long-term vision, the subgroup highlighted the following short- and intermediate-term research goals:
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6 For more information on ASTM F42, see https://www.astm.org/COMMITTEE/F42.htm, accessed March 11, 2019.
Participants at the workshop were also asked to provide their thoughts on the top priority research needs for advancing AM, top “nontechnical” challenges to commercialization of AM, and actions that could help address these nontechnical challenges. The individual responses were analyzed by a workshop subgroup and summarized by Celia Merzbacher (SRI International). She explained that the technical challenges suggested by the workshop participants centered on needing more AM materials, improving the understanding of microstructure prediction, developing standards and benchmark measurements, and improving in-situ monitoring capability. For nontechnical challenges, she explained that the responses centered on encouraging data sharing, increasing funding, improving training and education, enabling machine transparency, and increasing trust in AM parts. Many participants suggested that these challenges could be approached by increasing coordination and communication among stakeholders, perhaps through more convening activities, collaborations, standards, and funding.
Brain, M. 2001. “How Semiconductors Work.” April 25. HowStuffWorks.com. https://electronics.howstuffworks.com/diode1.htm, accessed March 11, 2019.
Business Dictionary. 2019. “Alloying Element.” http://www.businessdictionary.com/definition/alloying-element.html, accessed March 11, 2019.