High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop (2019)
Chapter: Appendix D: Acronyms
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Appendix C: Workshop Agenda
D
Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
D
Acronyms
| 1D | one-dimensional |
| 2D | two-dimensional |
| 3D | three-dimensional |
| AFM | atomic force microscopy |
| AIMD | ab initio molecular dynamic |
| ALD | atomic-layer deposition |
| BCC | body-centered cubic |
| CALPHAD | Computer Coupling of Phase Diagrams and Thermochemistry |
| CCA | complex concentrated alloy |
| CMOS | complementary metal-oxide-semiconductor |
| COI | community of interest |
| CVD | chemical vapor deposition |
| DFT | density functional theory |
| DMMI | Defense Materials Manufacturing and Infrastructure |
| DoD | Department of Defense |
| DOE | Department of Energy |
| DSA | directed self-assembly |
Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
| EUVL | extreme ultraviolet lithography |
| FCC | face-centered cubic |
| FET | field effect transistor |
| FinFET | fin field effect transistor |
| GPa | gigapascal |
| h-BN | hexagonal boron nitride |
| HCP | hexagonal-close packed |
| HEA | high-entropy alloy |
| ILP | instruction-level parallelism |
| IMEC | Interuniversity MicroElectronics Center |
| MOSFET | metal-oxide-semiconductor field effect transistor |
| MPEA | multi-principal-element alloy |
| NIST | National Institute of Standards and Technology |
| NMMB | National Materials and Manufacturing Board |
| NRI | Nanoelectronics Research Initiative |
| ORNL | Oak Ridge National Laboratory |
| PEB | perpendicular exchange bias |
| PI | principal investigator |
| SEM | scanning electron microscopy |
| TCAD | technology computer-aided design |
| TEM | transmission electron microscopy |
| TMD | transition metal dichalcogenide |
| TPa | terapascal |
| VAN | vertically aligned nanocomposite |
| XML | extensible markup language |
Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
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Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
Suggested Citation:
"Appendix D: Acronyms." National Academies of Sciences, Engineering, and Medicine. 2019. High-Entropy Materials, Ultra-Strong Molecules, and Nanoelectronics: Emerging Capabilities and Research Objectives: Proceedings of a Workshop. Washington, DC: The National Academies Press.
doi: 10.17226/25106.
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