| Organic Inventory | Mission Name: |
To be in compliance with planetary protection policy, the Mission shall provide an itemized list of bulk organic materials (defined as; all carbon-containing compounds including payload biological materials but excluding carbides, carbonates, cyanides and simple oxides of carbon [i.e., CO and CO2]) presented at the same level as the MIUL/materials list, as used on the flight hardware, estimated actual (in kg) for organic materials present in amounts larger than 1kg; “small amounts” for organic materials present in amounts between 1kg and 0.1kg, and; “traces” for identifiable organic materials present in amounts less than 0.1kg (Add more lines as needed for each line entry).
1) Adhesives and Potting Compounds
e.g., RTV/Silicones (DOW, Nusil, Hysol); polyurethanes such as arathane/solithane conformal coatings; epoxies such as Scotchweld, CFRP resin.
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
2) Primers, Paints and Inks
e.g. Aeroglaze Chemglaze etc.
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
3) Thermal Control Films
e.g., Kapton, FEP Teflon, Betacloth
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
4) Lubricants
e.g. Braycote Molybdenum Disulfide dry film
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
5) Plastics and Elastomeric Materials
e.g., Circuit board with PTFE GI polyimide resin (PWB or PCB); Wiring Overwraps: Silicones Kapton (polyimide); PEI (polyether imide); ETFE (tefzel); Nylon (polyamide); PTFE (teflon); Heat Shrink: Polyolefin or Polyvyniline Fluoride types; O-rings and seals with ethyl, propyl, butyl and Viton Rubber; Fluorosilicone Flectron Tape (polyester), EMI shielding including e.g.,Vespel (SP-1).
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NOTE: This “NASA Organic Inventory Template” was provided to the Committee on Planetary Protection by NASA Office of Planetary Protection in the Office of Safety and Mission Assurance.
| Material Name and Usage |
| Actual Amount (kg) | Small Amount | Traces | |
| 0.0 | |||
| 0.0 |
6) Tapes
Adhesive Tapes are principally represented by kapton (polyimide), polyester, FEP and Teflon backings with acrylic or silicone adhesives
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
7) Other
A range of other materials will need to be included, including e.g., Lacing Tape and Cards, Thread, Fibers such as Nomex, Dacron Scrim Cloth (polyester); DAP, Ultem PEI, PPS bulk castings; Nylon (Polyamide) used in structures; fiber, Velcro and vibe pads; propellant (MMH, UDMH); payload biological materials (living or dead).
| Material Name and Usage | Actual Amount (kg) | Small Amount | Traces |
| 0.0 | |||
| 0.0 |
OSMA/OPP/20190909