| AMD | Advanced Micro Devices, Inc. |
| ASIC | application-specific integrated circuit |
| ASML | Advanced Semiconductor Materials Lithography |
| CEO | chief executive officer |
| CHIPS | Creating Helpful Incentives to Produce Semiconductors |
| CMOS | complementary metal–oxide–semiconductor |
| DARPA | Defense Advanced Research Projects Agency |
| DFARS | Defense Federal Acquisition Regulation Supplement |
| DMEA | Defense Microelectronics Activity |
| DOC | Department of Commerce |
| DoD | Department of Defense |
| DRAM | dynamic random access memory |
| DSB | Defense Science Board |
| EAR | Export Administration Regulations |
| EDA | electronic design automation |
| ERI | Electronic Resurgence Initiative |
| EUV | extreme ultraviolet |
| FET | field-effect transistor |
| GOCO | government-owned, contractor-operated |
| IMEC | Interuniversity Microelectronics Centre |
| IRDS | International Roadmap for Devices and Systems |
| ITAR | International Traffic in Arms Regulations |
| ITRI | Industrial Technology Research Institute |
| MIT | Massachusetts Institute of Technology |
| MQA | Microelectronics Quantifiable Assurance |
| NAPMP | National Advanced Packaging Manufacturing Program |
| NASA | National Aeronautics and Space Administration |
| NDAA | National Defense Authorization Act |
| NGMM | Next-Generation Microelectronics Manufacturing |
| NIST | National Institute of Standards and Technology |
| NSF | National Science Foundation |
| NSTC | National Semiconductor Technology Center |
| PPP | public–private partnership |
| RAMP | Rapid Assured Microelectronics Prototypes |
| SEMATECH | Semiconductor Manufacturing Technology |
| SHIP | State-of-the-Art Heterogeneous Integrated Packaging |
| SIA | Semiconductor Industry Association |
| SOTA | state-of-the-art |
| SRC | Semiconductor Research Corporation |
| STEM | science, technology, engineering, and mathematics |
| TRL | technology readiness level |
| TSMC | Taiwan Semiconductor Manufacturing Company |