Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS

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Previous Chapter: APPENDIX F: EXAMPLES OF MULTICHIP MODULES
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Suggested Citation: "APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Suggested Citation: "APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 137 Cite Bookmark
Suggested Citation: "APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 137
Page 138 Cite Bookmark
Suggested Citation: "APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Save
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Page 138
Page 139 Cite Bookmark
Suggested Citation: "APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Save
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