Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: 4 MATERIALS ISSUES

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Previous Chapter: 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS
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Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 62 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 63 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 64 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 65 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 66 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 67 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 68 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 69 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 70 Cite Bookmark
Suggested Citation: "4 MATERIALS ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Next Chapter: 5 SOME SPECIFIC MATERIALS
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