Materials for High-Density Electronic Packaging and Interconnection (1990)
Chapter: APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
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APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS
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Suggested Citation:
"APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
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Suggested Citation:
"APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 120.
Suggested Citation:
"APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 121.
Suggested Citation:
"APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 122.
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