Materials for High-Density Electronic Packaging and Interconnection (1990)
Chapter: APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
Unfortunately, this book can't be printed from the OpenBook.
If you need to print pages from this book, we recommend
downloading it as a PDF.
Visit NAP.edu/10766 to get more information about this book, to buy it in print, or to download it as a free PDF.
Visit NAP.edu/10766 to get more information about this book, to buy it in print, or to download it as a free PDF.
Previous Chapter:
APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS
Next Chapter: APPENDIX E: MATERIALS PROPERTIES
Subscribe to Email from the National Academies
Keep up with all of the activities, publications, and events by subscribing to free updates by email.