Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT

Previous Chapter: 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES
Suggested Citation: "APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 105
Suggested Citation: "APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 106
Suggested Citation: "APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 107
Suggested Citation: "APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 108
Next Chapter: APPENDIX B: SOME INDUSTRY COMPONENT DATA
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