Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: APPENDIX E: MATERIALS PROPERTIES

Previous Chapter: APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES
Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.

There was a problem loading page 123.

Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.

There was a problem loading page 124.

Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.

There was a problem loading page 125.

Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.

There was a problem loading page 126.

Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 123
Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 124
Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 125
Suggested Citation: "APPENDIX E: MATERIALS PROPERTIES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Page 126
Next Chapter: APPENDIX F: EXAMPLES OF MULTICHIP MODULES
Subscribe to Emails from the National Academies
Stay up to date on activities, publications, and events by subscribing to email updates.