Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS

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Previous Chapter: 1 INTRODUCTION
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Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 23 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 24 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 25 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 26 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 27 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 28 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 29 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 30 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 31 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 32 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 33 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 34 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 35 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 36 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 36
Page 37 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 37
Page 38 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 39 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 39
Page 40 Cite Bookmark
Suggested Citation: "2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 40
Next Chapter: 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS
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