Materials for High-Density Electronic Packaging and Interconnection (1990)
Chapter: 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS
Visit
NAP.edu/10766
to get more information about this book, to buy it in print, or to
download it as a free PDF.
Previous Chapter:
1 INTRODUCTION
Next Chapter: 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 21.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 22.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 23.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 24.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 25.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 26.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 27.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 28.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 29.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 30.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 31.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 32.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 33.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 34.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 35.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 36.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 37.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 38.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 39.
Suggested Citation:
"2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press.
doi: 10.17226/1624.
There was a problem loading page 40.
Subscribe to Emails from the National Academies
Stay up to date on activities, publications, and events by subscribing to email updates.