Materials for High-Density Electronic Packaging and Interconnection (1990)

Chapter: 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES

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Previous Chapter: 5 SOME SPECIFIC MATERIALS
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Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 97 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 98 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 98
Page 99 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Save
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Page 99
Page 100 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
Save
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Page 100
Page 101 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 101
Page 102 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 102
Page 103 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 103
Page 104 Cite Bookmark
Suggested Citation: "6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES." National Research Council. 1990. Materials for High-Density Electronic Packaging and Interconnection. Washington, DC: The National Academies Press. doi: 10.17226/1624.
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Page 104
Next Chapter: APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT
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