Database Needs for Modeling and Simulation of Plasma Processing (1996)
Chapter: Appendix A: Acronyms and Abbreviations
Appendix A:
Acronyms and Abbreviations
AFM
atomic force microscopy
BEOL
back end of the line
CARS
coherent anti-Stokes Raman scattering
CD
critical dimension
CFM
contamination-free manufacturing
CMOS
complementary metal oxide semiconductor
CVD
chemical vapor deposition
DFWM
degenerate four-wave mixing
DRAM
dynamic random access memory
ECR
electron cyclotron resonance
E/N
ratio of electric field to gas density
FOM
Fundamenteel Onderzoek der Materie (a research institute in the Netherlands)
FTIR
Fourier transform infrared
FTMS
Fourier transform mass spectroscopy
IC
integrated circuit
ICP
inductively coupled plasma
IR
infrared
IRIS
imaging of radicals interacting with surfaces
JANAF
Joint Army-Navy-Air Force
Kn
Knudsen number
LIF
laser-induced fluorescence
MD
molecular dynamics
MOSFET
metal oxide semiconductor field effect transistor
MPU
microprocessor unit
NIST
National Institute of Standards and Technology
PECVD
plasma-enhanced chemical vapor deposition
PVD
physical vapor deposition
rf
radio frequency
RIE
reactive ion etching
SEM
scanning electron microscopy
SEP
stimulated emission pumping
SIA
Semiconductor Industry Association
SPIE
The International Society for Optical Engineering
TALIF
two-photon allowed laser-induced fluorescence
TEM
transmission electron microscopy
TEOS
tetraethoxysilane
UHV
ultrahigh vacuum
ULSI
ultralarge-scale integration
UV
ultraviolet
VLSI
very large scale integration
